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XCVC1802-1LSIVSVD1760

Part No :

XCVC1802-1LSIVSVD1760

Manufacturer
Xilinx
Description
IC VERSAL AICORE FPGA 1760BGA
Catalog
Embedded - System On Chip (SoC)
DataSheet
XCVC1802-1LSIVSVD1760 PDF
Unit Price
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Stock Num
0
Min Qty
1
Series
Versal™ AI Core
Package
Tray

XCVC1802-1LSIVSVD1760 Specifications

Type Description
rohs: RoHS
speed: 400MHz, 1GHz
ram size: 256KB
flash size: -
part status: Active
peripherals: DDR, DMA, PCIe
architecture: MPU, FPGA
connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
core processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
package / case: 1760-BFBGA, FCBGA
primary attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
operating temperature: -40°C ~ 100°C (TJ)
supplier device package: 1760-FCBGA (40x40)