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UPD70F3551M1GJA1-GBG-QS-AX

Part No :

UPD70F3551M1GJA1-GBG-QS-AX

Manufacturer
Intersil (Renesas Electronics America)
Description
IC MCU FLASH
Catalog
Embedded - Microcontrollers
DataSheet
UPD70F3551M1GJA1-GBG-QS-AX PDF
Unit Price
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Stock Num
0
Min Qty
1
Series
V850E2/Fx4
Package
Bulk

UPD70F3551M1GJA1-GBG-QS-AX Specifications

Type Description
rohs: RoHS
speed: 80MHz
ram size: 48K x 8
core size: 32-Bit
eeprom size: 32K x 8
part status: Last Time Buy
peripherals: DMA, POR, PWM, WDT
connectivity: CANbus, CSI, I²C, LINbus, UART/USART
mounting type: Surface Mount
number of i/o: 112
core processor: V850E2M
package / case: 144-LQFP Exposed Pad
data converters: A/D 24x12b
oscillator type: Internal
program memory size: 512KB (512K x 8)
program memory type: FLASH
operating temperature: -40°C ~ 110°C (TA)
supplier device package: 144-HLFQFP (20x20)
voltage - supply (vcc/vdd): 3V ~ 5.5V