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UPD70F3556AM1GMA1-GBK-E2-AX

Part No :

UPD70F3556AM1GMA1-GBK-E2-AX

Manufacturer
Intersil (Renesas Electronics America)
Description
IC MCU 32BIT 1MB FLASH 176HLQFP
Catalog
Embedded - Microcontrollers
DataSheet
UPD70F3556AM1GMA1-GBK-E2-AX PDF
Unit Price
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Stock Num
0
Min Qty
1
Series
V850E2/Fx4
Package
Tray

UPD70F3556AM1GMA1-GBK-E2-AX Specifications

Type Description
rohs: RoHS
speed: 80MHz
ram size: 80K x 8
core size: 32-Bit
eeprom size: 32K x 8
part status: Obsolete
peripherals: DMA, PWM, WDT
connectivity: CANbus, CSI, I²C, LINbus, UART/USART
mounting type: Surface Mount
number of i/o: 136
core processor: V850E2
package / case: 176-LQFP Exposed Pad
data converters: A/D 40x12b
oscillator type: Internal
program memory size: 1MB (1M x 8)
program memory type: FLASH
operating temperature: -40°C ~ 110°C (TA)
supplier device package: 176-HLQFP (24x24)
voltage - supply (vcc/vdd): 3V ~ 5.5V