UPD70F3557AM1GMA-GBK-E2-QS-AX
- Part No :
UPD70F3557AM1GMA-GBK-E2-QS-AX
- Manufacturer
- Intersil (Renesas Electronics America)
- Description
- IC MCU 32BIT 1.5MB FLSH 176HLQFP
- Catalog
- Embedded - Microcontrollers
- DataSheet
- UPD70F3557AM1GMA-GBK-E2-QS-AX PDF
- Unit Price
-
询价
QQ咨询
- Stock Num
- 0
- Min Qty
- 1
- Series
- V850E2/Fx4
- Package
- Tray
UPD70F3557AM1GMA-GBK-E2-QS-AX Specifications
| Type | Description |
|---|---|
| rohs: | RoHS |
| speed: | 80MHz |
| ram size: | 112K x 8 |
| core size: | 32-Bit |
| eeprom size: | 64K x 8 |
| part status: | Obsolete |
| peripherals: | DMA, PWM, WDT |
| connectivity: | CANbus, CSI, I²C, LINbus, UART/USART |
| mounting type: | Surface Mount |
| number of i/o: | 136 |
| core processor: | V850E2 |
| package / case: | 176-LQFP Exposed Pad |
| data converters: | A/D 40x12b |
| oscillator type: | Internal |
| program memory size: | 1.5MB (1.5M x 8) |
| program memory type: | FLASH |
| operating temperature: | -40°C ~ 85°C (TA) |
| supplier device package: | 176-HLQFP (24x24) |
| voltage - supply (vcc/vdd): | 3V ~ 5.5V |
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