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MEC1609I-PZP

Part No :

MEC1609I-PZP

Manufacturer
Microchip Technology
Description
MIXED SIGNAL MOBILE EMBEDDED CON
Catalog
Embedded - Microcontrollers - Application Specific
DataSheet
MEC1609I-PZP PDF
Unit Price
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Stock Num
0
Min Qty
240
Package
Tray

MEC1609I-PZP Specifications

Type Description
rohs: RoHS
ram size: 16KB
interface: ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI, VLPC
part status: Active
applications: I/O Controller
mounting type: Surface Mount
number of i/o: 115
core processor: ARC-625D
package / case: 144-LFBGA
voltage - supply: 3.3V
controller series: -
program memory type: FLASH (192kB)
operating temperature: -40°C ~ 85°C
supplier device package: 144-LFBGA (10x10)